Dicing Blades are used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material.
Dressing is the process of sharpening diamond particles in diamond bond matrix in order for the diamond particles to freely penetrate into the material, minimize loads, and provide good cut quality.
Back Grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.
Resistance Welding is a process by which metals can be joined together by applying pressure and conducting a strong electric current through the metal combination to heat up the welding joint and melt the metals, forging them together.
A Laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation.
Project: Dicing blade Cost down and blade life improvement
Our Capability: We had improve blade life increase 30% compare with current production blade.
OSRAM Opto Semiconductor
Project: Thick Ceramic
Our Capability: We able to control Chipping size <0.05mm with high feed speed.
Inari Amertron Berhad
Project : We provided various range of product to ZZSM