Dicing Blade
The Dicing Blade product have three categories:
1. Electro Plated Nickel Dicing Blade
2. Metal Bond High Precision Dicing Blade
3. Resin Bond High Precision Dicing Blade
For Wafer Nickel Dicing Blade main features ultra thin hub blades provide stable dicing performance of narrow street wafers.
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP), oxide wafer(LiTaO3) and others.
Key Parameter:
Diamond grit size: range from 1500 mesh – 5000 mesh
Blade size: thickness ratio (blade length and thickness ratio) to ensure the stiffness of the cutting edge.
Binder Hardness: 3 grades of nickel binder hardness
Diamond concentration: 5 levels of diamond concentration, to meet a variety of processing needs.
Developed for dicing various substrates adopts a larger grit size compared to the wafer dicing blades for semiconductor wafers. Also, the abundant concentration lineup meets a number of different customer requests.
Applications: Alumina ceramics, EMC, PCB and various semiconductor package base plate.
Key Parameter:
Diamond grit size: range from 300 mesh – 1200 mesh
Blade size: thickness ratio (blade length and thickness ratio) to ensure the stiffness of the cutting edge.
Binder Hardness: 3 grades of nickel binder hardness
Diamond concentration: 7 levels of diamond concentration, to meet a variety of processing needs.
The high precision super abrasive dicing blades are mainly used for precise cutting and slotting kinds of electronic component and precise part in the electronic information and the mechanical fields.
It has a series of merits such as high precision, small kerfs, high quality of processing surface and so on.
Applications:
Semiconductor, such as BGA, LGA, LED, diode and so on.
Optical glass, such as filter, blue glass, crystal and gem.
Optical communication, such as slotting-shape on quartz and cutting off quartz cover.
Other material, such as slotting and cutting off magnetic materials, carbide, tool steel and stainless steel.
